STRENGTHENING OUR ADVANCED PACKAGING LEADERSHIP

We’re excited to welcome Salman Mirza, Head of Advanced Packaging, and his talented team to GSME. This strategic addition accelerates our journey into heterogeneous packaging and reinforces our commitment to hyperscaler SoWoS packaging solutions. A new chapter begins now.

Salman is a true industry veteran with over 30 years of experience in IC package design and EDA tools. He has been instrumental in defining advanced packaging flows for technology giants like Apple, AMD, Intel, and Qualcomm, while supporting enterprise solutions for Google Cloud.

With deep expertise in 2.5D/3D architectures, Interposer designs, EMIB, and WLCSP, Salman and his team will be driving critical innovation in our high-performance data center and enterprise products, expanding GSME's end-to-end portfolio.

Welcome to the GSME family!